Transcend 112S internal SSD M.2 PCIe Gen 3*4 NVMe 2280
Specifications
Key features
- Adopts PCIe Gen3 x4 interface and NVMe 1.3 standard
- Up to 1,700 MB/s read; 1,400 MB/s write
- 3D NAND flash memory
- Engineered with LDPC (Low-Density Parity Check) coding to ensure data integrity; built-in SLC caching technology for exceptional transfer speeds
- Engineered dynamic thermal throttling mechanism
KSh15,000
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Product specifications
Transcend 112S internal SSD M.2 PCIe Gen 3*4 NVMe 2280
Specifications
The Specifications of Transcend 112S internal SSD
Appearance | |
| Dimensions | Single-sided: 80 mm x 22 mm x 2.23 mm (3.15″ x 0.87″ x 0.09″) Double-sided: 80 mm x 22 mm x 3.58 mm (3.15″ x 0.87″ x 0.14″) |
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| Weight | 8 g (0.28 oz) |
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Storage | |
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Operating Environment | |
| Operating Temperature | 0°C (32°F) ~ 70°C (158°F) |
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Performance | |
| Sequential Read/Write (CrystalDiskMark) |
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| 4K Random Read/Write (IOmeter) |
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| Terabytes Written (TBW) |
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| Mean Time Between Failures (MTBF) | 2,000,000 hour(s) |
| Drive Writes Per Day (DWPD) | 0.2 (5 yrs) |
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Compelling performance for high-end applications. Transcend’s PCIe SSD 110S/112S follows NVMe 1.3 and utilizes the PCIe™ Gen3 x4 interface, meaning four lanes are used for transmitting and receiving data simultaneously, resulting in compelling performance of up to 1,700MB/s read and 1,400MB/s write.
Understanding the PCIe interface
PCIe (or PCI Express®) is a much faster interface than SATA (or Serial ATA) for connecting a host computer to solid-state storage devices over one or more lanes consisting of one transmit and one receive serial interface in each lane, meaning it can better fulfill new performance requirements.
Understanding the NVMe standard
NVMe (or NVM Express®) is a host controller interface standard designed to address the needs of enterprise and client applications that utilize PCI Express-based solid-state storage. NVMe calls for better performance vectors than AHCI (Advanced Host Controller Interface), including scalable bandwidth, increased IOPS, and low latency.
3D expansion to break through limits
Unlike the existing planar NAND chips, 3D NAND flash is a type of flash memory in which the memory cells are stacked vertically in multiple layers. 3D NAND is developed to break through density limitations of the 2D planar NAND, and thus can deliver a greater level of performance and endurance.
Better endurance, higher reliability
Transcend’s PCIe SSD 110S/112S is engineered with LDPC (Low-Density Parity Check) coding, a powerful ECC algorithm, to keep data secure. Manufactured with high-quality NAND flash chips, and engineered dynamic thermal throttling mechanism, the PCIe SSD 110S/112S guarantees superior endurance and stability for high-end applications.